aos semiconductor product reliability report AON6554 , rev a plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
this aos product reliability report summarizes the qualification result for AON6554 . accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final electrical test result confirms that AON6554 passes aos quality and reliability requirements. table of contents: i. product description ii. package and die information iii. environmental stress test summary and result iv. reliability evaluation i. product description: general description: ? latest trench power alphamos (mos lv) technology ? very low rds(on) at 4.5v vgs ? low gate charge ? high current capability ? rohs and halogen - free compliant application: ? dc/dc converters in computing, servers, and pol ? isolated dc/dc c onverters in telecom and industrial detailed information refers to datasheet. ii. die / package information: AON6554 process standard sub - micron 30v n - channel alphamos package type dfn 5 x 6 lead frame c u die attach solder paste bonding clip mold material epoxy resin with silica filler msl (moisture sensitive level) level 1 based on j - std - 020 note * based on info rmation provided by assembler and mold compound supplier
iii. result of reliability stress for AON6554 test item test condition time point lot attribution total sample size number of failures standard msl precondition 168hr 85 c /85 %rh +3 cycle reflow@260c - 11 lots 2299 pcs 0 j esd22 - a113 htgb temp = 150 ? c , vgs=100% of vgsmax 168 hrs 500 hrs 1000 hrs 1 lot 3 lots (note a*) 308 pcs 77pcs / lot 0 jesd22 - a 108 htrb temp = 150 ? c , vds=80% of vdsmax 168 hrs 500 hrs 1000 hrs 1 lot 3 lots (note a*) 308 pcs 77pcs / lot 0 jesd22 - a108 hast 130 ? c , 85% rh , 33.3 psi, vgs = 100 % of vgs max 100 hrs 1 1 lots (note a*) 605 pcs 5 5 pcs / lot 0 jesd22 - a110 pressure pot 121 ? c , 29.7psi , rh=100% 96 hrs 1 1 lots (note a*) 847 pcs 77 pcs / lot 0 jesd22 - a102 temperature cycle - 65 ? c to 150 ? c , air to air 250 / 500 cycles 1 1 lots (note a*) 847 pcs 77 pcs / lot 0 jesd22 - a104 note a: the reliability data presents total of available generic data up to the published date. iv. reliability evaluation fit rate (per billion): 7 mt t f = 15704 years the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sample size of the selected product ( AON6554 ). failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 1.83 x 10 9 / [ 2 x ( 2x77x168+6 x77x1000) x 258 ] = 7 mt t f = 10 9 / fit = 1.38 x 10 8 hrs = 15704 years chi2 = chi squared distribution, determined by the number of failures and confidence interval n = total number of units from htrb and htgb tests h = duration of htrb/htgb testing af = acceleration factor from test to use conditions (ea = 0.7ev and tuse = 55 c ) acceleration factor [af ] = exp [ea / k ( 1/tj u C 1/tj s )] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 258 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u = the use junction temperature in degree (kelvin), k = c+273.16 k = boltz m an n s constant, 8.617164 x 10 - 5 e v / k
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